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Intel's New Omni Scale Fabric Platform: Taking on I/O Interconnect Challenges for Extreme-Scale HPC

June 27, 2014 9:42 am | by Doug Black | Intel Corp | Comments

Even as CPU power and memory bandwidth march forward, a major bottleneck hampering overall supercomputing performance has presented a significant challenge over the past decade: I/O interconnectivity. The vision behind Intel’s new Omni Scale Fabric is to deliver a platform for the next generation of HPC systems.

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