IBM in collaboration with NVIDIA and Mellanox announced the establishment of a POWER Acceleration and Design Center in Monpellier, France, to advance the development of data-intensive research, industrial and commercial applications. Born out of the collaborative of the OpenPOWER Foundation, the new Center provides commercial and open-source software developers with technical assistance to enable them to develop HPC applications.
Intel said July 2, 2015, that President Renee James, who has worked at the chipmaker for 28...
A typical computer chip includes millions of transistors connected with an extensive network of...
Much of the world’s industries are affected by weather. UBIMET is one of the world’s leading private weather service providers. The company offers a range of precise, real-time micro-climate forecasting and alerts, historical weather data, and other services to several million customers around the globe. UBIMET’s competitive advantage lies in the complex character of their solutions and depth of their science and technology.
The heat that builds up in the shuttling of current in electronics is an important obstacle to packing more computing power into ever-smaller devices: Excess heat can cause them to fail or sap their efficiency. Now, X-ray studies at the Department of Energy's SLAC National Accelerator Laboratory have for the first time observed an exotic property that could warp the electronic structure of a material in a way that reduces heat buildup.
Researchers have developed a relatively simple, robust and versatile process for growing crystals made from compound semiconductor materials that will allow them be integrated onto silicon wafers — an important step toward making future computer chips that will allow integrated circuits to continue shrinking in size and cost even as they increase in performance. The work may allow an extension to Moore's Law.
Intel is buying chip designer Altera for about $16.7 billion in cash. The transaction is the latest in ongoing consolidation in the industry that's aimed at boosting revenue and profit. Intel already partners with Altera, manufacturing some top-end chips designed by the much smaller company, while Altera has used some of Intel's chip-making technology in its designs.
Portable electronics — typically made of non-renewable, non-biodegradable, potentially toxic materials — are discarded at an alarming rate in consumers' pursuit of the next best electronic gadget. In an effort to alleviate the environmental burden of electronic devices, researchers developed a surprising solution: a semiconductor chip made almost entirely of wood. They addressed two key barriers: surface smoothness and thermal expansion.
Researchers have mimicked the way the human brain processes information with the development of an electronic long-term memory cell, which mirrors the brain’s ability to simultaneously process and store multiple strands of information. The development brings them closer to imitating key electronic aspects of the human brain — a vital step toward creating a bionic brain and unlocking treatments for Alzheimer’s and Parkinson’s diseases.
In case you missed it, here's another chance to catch this week's biggest hits. Writing like a genius; the largest individual structure ever identified by humanity; imaging fascinating, wild and unpredictable thunder; a car prototype that folds, shrinks and drives sideways; a high-efficiency laser system to remove space debris from orbit; and more are among the latest top stories.
AMD provided details the company’s multi-year strategy to drive profitable growth based on delivering next-generation technologies powering a broad set of high-performance, differentiated products. Technology-related announcements included development of a brand new x86 processor core codenamed “Zen,” that will feature simultaneous multi-threading (SMT) for higher throughput and a new cache subsystem.
Self-driving cars. Computers that detect tumors. Real-time speech translation. Just a few years ago, deep learning — training computers to identify patterns and objects, much like the way humans do — was the domain of a few artificial intelligence and data science researchers. No longer. Today, top experts use it to do amazing things. And they continue to push the bounds of what’s possible.
In the last 10 years, computer security researchers have shown that malicious hackers don’t need to see your data in order to steal your data. From the pattern in which your computer accesses its memory banks, adversaries can infer a shocking amount about what’s stored there.
Intel has announced that the U.S. Department of Energy’s (DOE) Argonne Leadership Computing Facility (ALCF) has awarded Intel Federal LLC, a wholly-owned subsidiary of Intel Corporation, a contract to deliver two next-generation supercomputers to Argonne National Laboratory.
Total has chosen SGI to upgrade its supercomputer Pangea. Total is one of the largest integrated oil and gas companies in the world, with activities in more than 130 countries. Its 100,000 employees put their expertise to work in every part of the industry — the exploration and production of oil and natural gas, refining, chemicals, marketing and new energies. This updated system would place in the top 10 of the latest TOP500 list.
NVIDIA has announced that its Pascal GPU architecture, set to debut next year, will accelerate deep learning applications 10X beyond the speed of its current-generation Maxwell processors. NVIDIA CEO and co-founder Jen-Hsun Huang revealed details of Pascal and the company’s updated processor roadmap in front of a crowd of 4,000 during his keynote address at the GPU Technology Conference, in Silicon Valley.
The Penguin Tundra cluster platform is based on Open Compute Project rack-level infrastructure, and is designed to deliver the highest density and lowest total-cost-of-ownership for high performance technical computing clusters. The product line includes compute sled, storage sled and an Intel Xeon Phi processor-based motherboard.
Ansys has announced that engineers using ANSYS 16.0 in combination with Intel Xeon technology can realize a 300 percent decrease in solution time. The ANSYS and Intel partnership ensures that simulation engineers performing structural analysis can expect seamless high-performance computing (HPC) operations with multi-core Xeon E5 v3 processors and many-core Xeon Phi coprocessors.
The HPC and enterprise communities are experiencing a paradigm shift as FLOPs per watt, rather than FLOPs (floating-point operations per second), are becoming the guiding metric in procurements, system design, and now application development. In short, “performance at any cost” is no longer viable, as the operational costs of supercomputer clusters are now on par with the acquisition cost of the hardware itself.
The Intel Xeon Processor D-1500 High Density Server Family is a new class of low-power, high density server solutions optimized for Embedded and hyperscale workloads in data center and cloud environments. The servers are available in a growing line of single processor (UP) motherboards, 1U and Mini-Tower server for Embedded, Network Communication/Security applications and coming high density 6U 56-node MicroBlade microserver for hyperscale environments.
A relentless global effort to shrink transistors has made computers continually faster, cheaper and smaller over the last 40 years. This effort has enabled chipmakers to double the number of transistors on a chip roughly every 18 months — a trend referred to as Moore's Law. In the process, the U.S. semiconductor industry has become one of the nation's largest export industries, valued at more than $65 billion a year.
The drive toward exascale computing, renewed emphasis on data-centric processing, energy efficiency concerns, and limitations of memory and I/O performance are all working to reshape HPC platforms, according to Intersect360 Research’s Top Six Predictions for HPC in 2015. The report cites many-core accelerators, flash storage, 3-D memory, integrated networking, and optical interconnects as just some of the technologies propelling future...
Children don’t have to be told that “cat” and “cats” are variants of the same word — they pick it up just by listening. To a computer, though, they’re as different as, well, cats and dogs. Yet it’s computers that are assumed to be superior in detecting patterns and rules, not four-year-olds. Researchers are trying to, if not to solve that puzzle definitively, at least provide the tools to do so.
We computational chemists are an impatient lot. Despite the fact that we routinely deal with highly complicated chemical processes running on our laboratory’s equally complex HPC clusters, we want answers in minutes or hours, not days, months or even years. In many instances, that’s just not feasible; in fact, there are times when the magnitude of the problem simply exceeds the capabilities of the HPC resources available to us.
GPU-accelerated applications have become ubiquitous in scientific supercomputing. Now, we are seeing increased adoption of GPU technology in other computationally demanding disciplines, including deep learning, one of the fastest growing areas in the machine learning and data science fields
Computer chips’ clocks have stopped getting faster. To keep delivering performance improvements, chipmakers are instead giving chips more processing units, or cores, which can execute computations in parallel. But the ways in which a chip carves up computations can make a big difference to performance.
Optimization for high-performance and energy efficiency is a necessary next step after verifying that an application works correctly. In the HPC world, profiling means collecting data from hundreds to potentially many thousands of compute nodes over the length of a run. In other words, profiling is a big-data task, but one where the rewards can be significant — including potentially saving megawatts of power or reducing the time to solution
Researchers have created the first transistors made of silicene, the world’s thinnest silicon material. Their research holds the promise of building dramatically faster, smaller and more efficient computer chips.
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