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Europe’s second POWER Acceleration and Design Center is located at the IBM Research & Development Lab in Montpellier, France, where developers can get hands-on, technical assistance for creating OpenPOWER-based high performance computing apps.

IBM, NVIDIA and Mellanox Launch Design Center for Big Data and HPC

July 2, 2015 2:21 pm | by IBM | News | Comments

IBM in collaboration with NVIDIA and Mellanox announced the establishment of a POWER Acceleration and Design Center in Monpellier, France, to advance the development of data-intensive research, industrial and commercial applications. Born out of the collaborative of the OpenPOWER Foundation, the new Center provides commercial and open-source software developers with technical assistance to enable them to develop HPC applications.

Intel President Renee James to leave Chipmaker

July 2, 2015 12:31 pm | by AP | News | Comments

Intel said July 2, 2015, that President Renee James, who has worked at the chipmaker for 28...

Simple yet Clever Approach Boosts Chip Speeds by 30 Percent

June 18, 2015 5:34 pm | by Tom Abate, Stanford University | News | Comments

A typical computer chip includes millions of transistors connected with an extensive network of...

Stories You Shouldn’t Miss — June 5-11

June 12, 2015 3:39 pm | by Suzanne Tracy, Editor-in-Chief, Scientific Computing and HPC Source | News | Comments

In case you missed it, here's another chance to catch this week's biggest hits. Software and “...

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The Ubimet Weather Cockpit allows golf courses, race venues and other clients to access site specific weather information unique to their topography.

Weather Matters: Enabling Precise, Real-time Forecasts

June 11, 2015 3:47 pm | by Ken Strandberg | Articles | Comments

Much of the world’s industries are affected by weather. UBIMET is one of the world’s leading private weather service providers. The company offers a range of precise, real-time micro-climate forecasting and alerts, historical weather data, and other services to several million customers around the globe. UBIMET’s competitive advantage lies in the complex character of their solutions and depth of their science and technology.

A property known as 3-D negative electronic compressibility, observed for the first time in research conducted, in part, at SLAC National Accelerator Laboratory, could potentially be used in components for computer chips, like the one pictured here, to re

Exotic Material’s 3-D Property could help Beat Heat in Computer Chips

June 11, 2015 9:29 am | by SLAC National Accelerator Laboratory | News | Comments

The heat that builds up in the shuttling of current in electronics is an important obstacle to packing more computing power into ever-smaller devices: Excess heat can cause them to fail or sap their efficiency. Now, X-ray studies at the Department of Energy's SLAC National Accelerator Laboratory have for the first time observed an exotic property that could warp the electronic structure of a material in a way that reduces heat buildup.

Scanning electron microscope images of single crystal structures fabricated using template-assisted selective epitaxy. For better visibility, the silicon is colored in green, and the compound semiconductor in red. Courtesy of H. Schmid/IBM

Futuristic Components on Silicon Chips, Fabricated Successfully

June 9, 2015 9:44 am | by Jason Bardi, American Institute of Physics (AIP) | News | Comments

Researchers have developed a relatively simple, robust and versatile process for growing crystals made from compound semiconductor materials that will allow them be integrated onto silicon wafers — an important step toward making future computer chips that will allow integrated circuits to continue shrinking in size and cost even as they increase in performance. The work may allow an extension to Moore's Law.

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Microchip maker Intel is buying chip designer Altera for about $16.7 billion in cash, the company announced, June 1, 2015. (AP Photo/Laura Rauch)

Intel Buying Chip Designer Altera for about $16.7 Billion

June 1, 2015 10:33 am | by AP | News | Comments

Intel is buying chip designer Altera for about $16.7 billion in cash. The transaction is the latest in ongoing consolidation in the industry that's aimed at boosting revenue and profit. Intel already partners with Altera, manufacturing some top-end chips designed by the much smaller company, while Altera has used some of Intel's chip-making technology in its designs.

Cai's group addressed two key barriers to using wood-derived materials in an electronics setting: surface smoothness and thermal expansion.

New Kind of Computer Chip uses Flexible, Biodegradable Cellulose Nanofibril Substrate

May 27, 2015 10:25 am | by John Steeno, University of Wisconsin-Madison | News | Comments

Portable electronics — typically made of non-renewable, non-biodegradable, potentially toxic materials — are discarded at an alarming rate in consumers' pursuit of the next best electronic gadget. In an effort to alleviate the environmental burden of electronic devices, researchers developed a surprising solution: a semiconductor chip made almost entirely of wood. They addressed two key barriers: surface smoothness and thermal expansion.

Scientists are now closer to imitating key electronic aspects of the human brain — a vital step towards creating a bionic brain.

Researchers take Vital Step toward Creating Bionic Brain

May 19, 2015 3:08 pm | by RMIT University | News | Comments

Researchers have mimicked the way the human brain processes information with the development of an electronic long-term memory cell, which mirrors the brain’s ability to simultaneously process and store multiple strands of information. The development brings them closer to imitating key electronic aspects of the human brain — a vital step toward creating a bionic brain and unlocking treatments for Alzheimer’s and Parkinson’s diseases.

Autonomous Car Prototype Folds, Shrinks, Drives Sideways

Recap: The Week's Top Stories — May 8-14

May 15, 2015 2:34 pm | by Suzanne Tracy, Editor-in-Chief, Scientific Computing and HPC Source | News | Comments

In case you missed it, here's another chance to catch this week's biggest hits. Writing like a genius; the largest individual structure ever identified by humanity; imaging fascinating, wild and unpredictable thunder; a car prototype that folds, shrinks and drives sideways; a high-efficiency laser system to remove space debris from orbit; and more are among the latest top stories.

Technology-related announcements included:      Development of a brand new x86 processor core codenamed “Zen,” expected to drive AMD’s re-entry into high-performance desktop and server markets through improved instructions per clock of up to 40 percent, c

AMD Announces “Zen” x86 Processor Core

May 7, 2015 12:11 pm | by AMD | News | Comments

AMD provided details the company’s multi-year strategy to drive profitable growth based on delivering next-generation technologies powering a broad set of high-performance, differentiated products. Technology-related announcements included development of a brand new x86 processor core codenamed “Zen,” that will feature simultaneous multi-threading (SMT) for higher throughput and a new cache subsystem.

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NYU has installed a new computing system for next-generation deep learning research — called “ScaLeNet” — that will allow researchers to significantly increase the size of deep learning models that can be trained and number of models that can be tested.

NYU to Advance Deep Learning Research with Multi-GPU Cluster

May 5, 2015 11:37 am | by Kimberly Powell, NVIDIA | News | Comments

Self-driving cars. Computers that detect tumors. Real-time speech translation. Just a few years ago, deep learning — training computers to identify patterns and objects, much like the way humans do — was the domain of a few artificial intelligence and data science researchers. No longer. Today, top experts use it to do amazing things. And they continue to push the bounds of what’s possible.

Cloud Security Reaches Silicon: Defending against Memory-access Attacks

April 23, 2015 1:53 pm | by Larry Hardesty, MIT | News | Comments

In the last 10 years, computer security researchers have shown that malicious hackers don’t need to see your data in order to steal your data. From the pattern in which your computer accesses its memory banks, adversaries can infer a shocking amount about what’s stored there.

Argonne’s decision to utilize Intel’s HPC scalable system framework stems from the fact it is designed to deliver a well-balanced and adaptable system capable of supporting both compute-intensive and data-intensive workloads

Intel to Deliver Nation’s Most Powerful Supercomputer at Argonne

April 9, 2015 2:07 pm | by Intel | News | Comments

Intel has announced that the U.S. Department of Energy’s (DOE) Argonne Leadership Computing Facility (ALCF) has awarded Intel Federal LLC, a wholly-owned subsidiary of Intel Corporation, a contract to deliver two next-generation supercomputers to Argonne National Laboratory.

The current Pangea supercomputer is a 2.3 petaflop system based on the Intel Xeon E5-2670 v3 processor that consists of 110,592 cores and contains 442 terabytes of memory built on SGI ICE X, one of the world's fastest commercial distributed memory superco

Total Partners with SGI to Upgrade its Pangea Supercomputer

April 1, 2015 11:27 am | by SGI | News | Comments

Total has chosen SGI to upgrade its supercomputer Pangea. Total is one of the largest integrated oil and gas companies in the world, with activities in more than 130 countries. Its 100,000 employees put their expertise to work in every part of the industry — the exploration and production of oil and natural gas, refining, chemicals, marketing and new energies. This updated system would place in the top 10 of the latest TOP500 list.

Pascal will offer better performance than Maxwell on key deep-learning tasks.

NVIDIA’s Next-Gen Pascal GPU Architecture to Provide 10X Speedup for Deep Learning Apps

March 18, 2015 12:24 pm | News | Comments

NVIDIA has announced that its Pascal GPU architecture, set to debut next year, will accelerate deep learning applications 10X beyond the speed of its current-generation Maxwell processors. NVIDIA CEO and co-founder Jen-Hsun Huang revealed details of Pascal and the company’s updated processor roadmap in front of a crowd of 4,000 during his keynote address at the GPU Technology Conference, in Silicon Valley.

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Penguin Tundra Cluster Platform

Penguin Tundra Cluster Platform

March 13, 2015 9:18 am | Penguin Computing | Product Releases | Comments

The Penguin Tundra cluster platform is based on Open Compute Project rack-level infrastructure, and is designed to deliver the highest density and lowest total-cost-of-ownership for high performance technical computing clusters. The product line includes compute sled, storage sled and an Intel Xeon Phi processor-based motherboard.

ANSYS 16.0's structural mechanics suite supports Xeon Phi with shared-memory and distributed-memory parallelism for both the Linux and Windows platforms.

ANSYS, Intel Collaborate to Spur Innovation

March 13, 2015 9:10 am | by ANSYS | News | Comments

Ansys has announced that engineers using ANSYS 16.0 in combination with Intel Xeon technology can realize a 300 percent decrease in solution time. The ANSYS and Intel partnership ensures that simulation engineers performing structural analysis can expect seamless high-performance computing (HPC) operations with multi-core Xeon E5 v3 processors and many-core Xeon Phi coprocessors.

Rob Farber is an independent HPC expert to startups and Fortune 100 companies, as well as government and academic organizations.

Optimizing Application Energy Efficiency Using CPUs, GPUs and FPGAs

March 13, 2015 8:43 am | by Rob Farber | Articles | Comments

The HPC and enterprise communities are experiencing a paradigm shift as FLOPs per watt, rather than FLOPs (floating-point operations per second), are becoming the guiding metric in procurements, system design, and now application development. In short, “performance at any cost” is no longer viable, as the operational costs of supercomputer clusters are now on par with the acquisition cost of the hardware itself.

The Intel Xeon Processor D-1500 High Density Server Family is a new class of low-power, high density server solutions optimized for Embedded and hyperscale workloads in data center and cloud environments. The servers are available in a growing line of sin

Intel Xeon Processor D-1500 High Density Server Family

March 10, 2015 10:02 am | Super Micro Computer, Inc. | Product Releases | Comments

The Intel Xeon Processor D-1500 High Density Server Family is a new class of low-power, high density server solutions optimized for Embedded and hyperscale workloads in data center and cloud environments. The servers are available in a growing line of single processor (UP) motherboards, 1U and Mini-Tower server for Embedded, Network Communication/Security applications and coming high density 6U 56-node MicroBlade microserver for hyperscale environments.

Visualizations of future nano-transistors, clockwise starting at upper left: a) the organization of the atoms in an Ultra Thin Body (UTB) transistor and the amount of electric potential along the transistor. b) a visualization of the organization of the a

Designing the Building Blocks of Future Nano-computing Technologies

March 4, 2015 12:38 pm | by NSF | News | Comments

A relentless global effort to shrink transistors has made computers continually faster, cheaper and smaller over the last 40 years. This effort has enabled chipmakers to double the number of transistors on a chip roughly every 18 months — a trend referred to as Moore's Law. In the process, the U.S. semiconductor industry has become one of the nation's largest export industries, valued at more than $65 billion a year.

According to Chief Research Officer Christopher Willard, Ph.D. “2015 will see increased architectural experimentation. Users will test both low-cost nodes and new technology strategies in an effort to find a balance between these options that delivers the

Top 6 Predictions for High Performance Computing in 2015

March 2, 2015 12:41 pm | by Intersect360 Research | Blogs | Comments

The drive toward exascale computing, renewed emphasis on data-centric processing, energy efficiency concerns, and limitations of memory and I/O performance are all working to reshape HPC platforms, according to Intersect360 Research’s Top Six Predictions for HPC in 2015. The report cites many-core accelerators, flash storage, 3-D memory, integrated networking, and optical interconnects as just some of the technologies propelling future...

The University of Chicago’s Research Computing Center is helping linguists visualize the grammar of a given word in bodies of language containing millions or billions of words. Courtesy of Ricardo Aguilera/Research Computing Center

Billions of Words: Visualizing Natural Language

February 27, 2015 3:14 pm | by Benjamin Recchie, University of Chicago | News | Comments

Children don’t have to be told that “cat” and “cats” are variants of the same word — they pick it up just by listening. To a computer, though, they’re as different as, well, cats and dogs. Yet it’s computers that are assumed to be superior in detecting patterns and rules, not four-year-olds. Researchers are trying to, if not to solve that puzzle definitively, at least provide the tools to do so.

NWChem molecular modeling software takes full advantage of a wide range of parallel computing systems, including Cascade. Courtesy of PNNL

PNNL Shifts Computational Chemistry into Overdrive

February 25, 2015 8:29 am | by Karol Kowalski, Ph.D., and Edoardo Apra, Ph.D. | Articles | Comments

We computational chemists are an impatient lot. Despite the fact that we routinely deal with highly complicated chemical processes running on our laboratory’s equally complex HPC clusters, we want answers in minutes or hours, not days, months or even years. In many instances, that’s just not feasible; in fact, there are times when the magnitude of the problem simply exceeds the capabilities of the HPC resources available to us.

Stephen Jones is Product Manager, Strategic Alliances at NVIDIA.

Powering a New Era of Deep Learning

February 20, 2015 12:42 pm | by Stephen Jones, NVIDIA | Blogs | Comments

GPU-accelerated applications have become ubiquitous in scientific supercomputing. Now, we are seeing increased adoption of GPU technology in other computationally demanding disciplines, including deep learning, one of the fastest growing areas in the machine learning and data science fields

Daniel Sanchez, Nathan Beckmann and Po-An Tsai have found that the ways in which a chip carves up computations can make a big difference to performance. -- Courtesy of Bryce Vickmark

Making Smarter, Much Faster Multicore Chips

February 19, 2015 2:02 pm | by Larry Hardesty, MIT | News | Comments

Computer chips’ clocks have stopped getting faster. To keep delivering performance improvements, chipmakers are instead giving chips more processing units, or cores, which can execute computations in parallel. But the ways in which a chip carves up computations can make a big difference to performance.

Rob Farber is an independent HPC expert to startups and Fortune 100 companies, as well as government and academic organizations.

Using Profile Information for Optimization, Energy Savings and Procurements

February 9, 2015 12:11 pm | by Rob Farber | Articles | Comments

Optimization for high-performance and energy efficiency is a necessary next step after verifying that an application works correctly. In the HPC world, profiling means collecting data from hundreds to potentially many thousands of compute nodes over the length of a run. In other words, profiling is a big-data task, but one where the rewards can be significant — including potentially saving megawatts of power or reducing the time to solution

Researchers have created the first transistors made of silicene, the world’s   thinnest silicon material. Their research holds the promise of building dramatically   faster, smaller and more efficient computer chips.

One-Atom-Thin Silicon Transistors become a Reality for Super-Fast Computing

February 3, 2015 3:44 pm | by University of Texas at Austin | News | Comments

Researchers have created the first transistors made of silicene, the world’s thinnest silicon material. Their research holds the promise of building dramatically faster, smaller and more efficient computer chips.           

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